The 640×512 series Infrared Thermal Imaging Core, High Res IR Thermal Module

ERDI 640×512 Uncooled Infrared Thermal Imaging Core Module—industrial-grade thermal core with vanadium oxide detector (640×512 resolution, 12um pixel pitch, 50Hz frame rate, 8~14um LWIR, NETD ≤35mK). Ultra-compact (26×26×25mm, <25g) and low-power (<0.85W without expansion), 5V powered with flexible swappable interfaces (BT656/MIPI/USB/SDI). 9.1-50mm lens options for 1100-6100m detection; rugged (-40°C~+60°C, vibration/shock resistant) for extreme environments. Perfect for UAV recon, life detection, robotics, security, firefighting & automotive visual augmentation. In-house built, 1-year warranty, customizable expansion components.

The 640×512 series of uncooled infrared modules utilize low-power FPGA image processing chips and incorporate proprietary high-performance image processing algorithms. They offer a variety of digital interfaces, enabling flexible integration with various intelligent processing platforms. These modules feature high performance, compact size, lightweight design, low power consumption, and low cost. Their industrial-grade quality meets the demanding requirements of numerous application environments.

Component Model

 

Detector Type

Uncooled vanadium oxide infrared focal plane array detector

Resolution

640×512

Detector Frame Rate

50Hz

Pixel Pitch

12um

Operating Wavelength Range

8~14um

Noise-Equivalent Temperature Difference (NETD)

≤35mK@25℃,F#1.0

Image Adjustment

Brightness Adjustment

0–10 levels available

Contrast Adjustment

0–10 levels available

Enhancement

0–10 levels available

False Color

Multiple color palettes, including black-and-white, white-and-black, iron red, and red-hot

 

 

Image Processing

Non-uniformity correction

Time-domain filtering

Spatial filtering and noise reduction

Digital detail enhancement

Histogram-based exposure adjustment

Power Supply

Supply Voltage

5V±0.5

Typical Power Consumption @ 25°C

<0.85 W (without expansion pack)

<1.2 W (with expansion pack)

Module Interface

Digital Video

BT656/Camerlink/MIPI/USB/SDI etc.（Replace the interface board)

Communication Interface

UART*2/RS232*2

Physical Characteristics of the Module (excluding lens and flange)

Weight

<25g

Dimensions

26mm×26mm×25mm

Environmental adaptability

Operating Temperature

-40℃~+60℃

Storage Temperature

-40℃~+80℃

Humidity

5%–95%, non-condensing

Vibration

6.06 g, random vibration, all axes

Shock

80 g @ 4 ms, sawtooth waveform, 3 axes, 6 directions

 

9.1mm/F1.0

FOV: 28.4 (H) × 21.5 (V)

FOV: 45.8 (H) × 37.3 (V)

Detection: 1,100 m

Detection: 1,100 m

Identification: 250 m

Identification: 250 m

Recognition: 170 m

Recognition: 170 m

 

13mm/F1.0

FOV: 20.1 (H) × 15.1 (V)

FOV: 32.9 (H) × 26.5 (V)

Detection: 1,300 m

Detection: 1,300 m

Identification: 320 m

Identification: 325 m

Identification: 190 m

Identification: 190 m

 

19mm/F1.1

FOV: 13.8 (H) × 10.3 (V)

FOV: 22.8 (H) × 18.3 (V)

Detection: 2000 m

Detection: 2000 m

Recognition: 500 m

Recognition: 500 m

Identification: 250 m

Identification: 250 m

 

25mm/F1.0

FOV: 10.5 (H) × 7.9 (V)

FOV: 17.5 (H) × 14.0 (V)

Detection: 2800 m

Detection: 2800 m

Recognition: 700 m

Recognition: 700 m

Identification: 350 m

Identification: 350 m

 

35mm/F1.0

FOV: 7.5 (H) × 5.7 (V)

FOV: 12.5 (H) × 10.0 (V)

Detection: 3,900 m

Detection: 3900 m

Recognition: 970 m

Identification: 970 m

Identification: 490 m

Recognition: 490 m

 

50mm/F1.0

FOV: 5.2 (H) × 3.9 (V)

FOV: 8.7 (H) × 7.0 (V)

Detection: 6,100 m

Detection: 6100 m

Recognition: 1,500 m

Identification: 1500 m

Identification: 760 m

Recognition: 760 m
2D Dimension Image 2D Dimension Image 2D Dimension Image
Communication Interface Communication Interface
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